TC11 High Temperature Mechanical Testing

Chairman	Mr P. McCarthy	Consultant Contact E-mails: paul@paulmccarthyconsulting.com
Vice-Chairman	Dr H. Klingelhoffer	BAM, Berlin, Germany Contact E-mails: Hellmuth.Klingelhoeffer@bam.de
Secretary	Mr M S Loveday	Div of Materials Metrology, NPL Building 7, Teddington, Middlesex, TW11 0LW, UK Contact E-mails: malcolm.loveday@npl.co.uk

AIMS
To improve high temperature testing by:

Providing a Forum for discussion
Organising conferences and laboratory visits
Publishing conference proceedings and Codes of Practice
Initiating research activities
A Council meets twice a year for conducting formal business, holding a Technical Presentation and arranging one- or two-day Symposia. Current measurement Working Groups include Notch Creep Testing, Testing of Welds, and Cyclic Stress-Strain Testing.

TC11 UPDATE 2006

Minutes of the meeting of the High Temperature Mechanical Testing Committee ( HTMTC) which was held on Friday 26th April 2006 at QinetiQ, Farnborough, UK

Minutes of the meeting of the High Temperature Mechanical Testing Committee ( HTMTC) which was held in Berlin in September 2005

Aims Information Leaflet of the HTMTC which lists the current Members of the Main Executive Committee.

TC11 UPDATE 2005

Under the auspices of ESIS TC11, the High Temperature Mechanical Testing Committee, a successful meeting on Miniaturised Testing Techniques was held on 17th & 18th March 2003, at the National Physical Laboratory, Teddington, UK. The meeting was attended by over 40 delegates, from several different countries, who listened with interest to 20 presentations. It was recognised that demands for smaller components in the Bio-medical, Aerospace, Automotive and General engineering sectors, together with the need for the characterisation of small samples removed from large power plant for remanent life assessment, all pose challenges for scientists and engineers to develop new miniaturised test methods for determining material property data. The meeting brought together research workers from different disciplines to share experiences of developing nano-, micro-, and sub-sized testing techniques for determining material characteristics of metals, ceramics and plastics at ambient and high temperatures. Novel testing methods were discussed as well as the methods used for in-situ testing in Scanning and Transition Electron Microscopes ( SEM & TEM's).

Topic covered included :

Historical Background, Standards & Traceability

Creep & Tensile Testing : Weld Testing & Ring Tests

Small punch test: Compression & Creep

Nano-Indentation

Scanning Micro-Hardness

Miniature Multi Property Apparatus

Miniature & Midi TMF Testing

In-situ TEM & SEM Testing

Nano Stain Measurement

Miniature Compression Testing

Surface Acoustic Wave Techniques

Modulus Measurements

Fracture Toughness / Impact :Drop weight , Miniature CTS & Sub-sized Charpy

Bend Testing : Miniature 4-Point Bend testing

A CD Rom is being compiled and should shortly be available which will contain the majority of the presentations.
For further information please contact Malcolm.Loveday@npl.co.uk

TC11 Members and e-mail contact

High Temperature Mechanical Testing Committee 2003 /2004

Chairman's Report 2002 / 2003